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Engineering Services

From Design to a complete product (Include DFM, DFT)
Program Management for Prototype & Volume Production
Boards & system design
Engineering & Local Support

Manufacturing Capabilities & Services

NPI New Products Introduction
PCB Assembly & box building assembly
Full Turnkey
Low, Medium & High Volume capability
High Precision Plastic Molds and injection
Metal Parts
Testing: ICT & FT, Troubleshooting
Packaging & Shipment

SMT & Plated Through Hole
Fine Pitch, QFP, BGA, and Micro BGA
Wire Bonding, COB, COF, COG, Flip Chip
Mixed Technologies

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